A novel method of measuring microelectronic interconnect transmission line parameters and discontinuity equivalent electrical parameters using multiple reflections

被引:6
作者
Abernethy, CE
Cangellaris, AC
Prince, JL
机构
[1] Center for Electronic Packaging Research, Department of Electrical and Computer Engineering, University of Arizona, Tucson
来源
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING | 1996年 / 19卷 / 01期
关键词
microelectronic interconnect transmission; microstrip transmission lines; ground plane; skin resistance;
D O I
10.1109/96.486480
中图分类号
T [工业技术];
学科分类号
08 [工学];
摘要
This paper describes a novel technique which measures the electrical properties of transmission lines (such as microstrip) and extracts equivalent electrical parameters for discontinuities in transmission lines with remarkable precision using a modern network analyzer and newly developed de-embedding software. This technique has successfully measured the per-unit-length inductance (L'), resistance (R'), capacitance (C'), and dielectric loss conductance (G') of microstrip transmission lines made from solid copper and conductive polymer, These materials have been studied at frequencies up to 201 MHz, and higher frequencies are possible, Discontinuities, such as an opening in the ground plane under the microstrip, have also been characterized at frequencies up to 2400 MHz. Measurements of characteristic impedances and skin resistances made by this method are in agreement with theoretical models, Higher frequency measurements should be feasible using a higher frequency network analyzer.
引用
收藏
页码:32 / 39
页数:8
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