Nanoscale embossing of polymers using a thermoplastic die

被引:33
作者
Casey, BG
Cumming, DRS
Khandaker, II
Curtis, ASG
Wilkinson, CDW
机构
[1] Dept. of Electronics and Elec. E., University of Glasgow
[2] Dept. of Elec. and Electron. E., University of Canterbury, Christchurch
[3] IBLS Div. of Infection and Immunity, University of Glasgow, Glasgow
关键词
D O I
10.1016/S0167-9317(99)00031-3
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper we present a novel mechanical pattern transfer process where direct written perspex substrates are used as the master dies for embossing. Using this nanofabrication process we have produced efficient diffractive optical elements. The yield, repeatability and efficiency of the original perspex samples are excellent and these characteristics are carried over into the replicas. At a smaller scale we have fabricated arrays of 60nm diameter nanopillars with excellent uniformity over large areas which have been successfully applied in cell engineering applications.
引用
收藏
页码:125 / 128
页数:4
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