Reliability evaluations of under bump metallurgy in two solder systems

被引：4

作者：

Guo, YF ^{[1
]}

Kuo, SM ^{[1
]}

Zhang, C ^{[1
]}

机构：

[1] Motorola Inc, Semicond Prod Sector, Tempe, AZ 85284 USA

来源：

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 2001年 / 24卷 / 04期

关键词：

electronic packaging; pull test; reliability; solder joint; under bump metallurgy;

D O I：

10.1109/6144.974957

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Under bump metallurgy (UBM) reliability is one of the critical issues in the total reliability of a flip-chip bumping technology. Since the UBM materials and structures vary for different bumping technologies, the UBM strength and reliability need to be determined for each design and process. In addition, the stress that a UBM experiences during thermal cycles depends on the solder alloy used in the interconnect. Different solder alloys require different UBM structures and strengths to achieve good reliability in thermal cycling. In this study, a simplified stress model is developed to determine the UBM stress during thermal cycling. A simplified stress model for the UBM strength is also developed. These models are used to predict the stress and strength of the UBM under the die pull test and the thermal cycle conditions for both eutectic and high lead solder systems. A methodology for using the pull test results to evaluate UBM reliability is also discussed. This methodology can be extended to the studies of UBM's with other solder systems such as lead free solder systems.

引用

页码：655 / 660

页数：6