Decomposition of PFCs by steam plasma at atmospheric pressure

被引:29
作者
Kim, Dong-yun
Park, Dong Wha [1 ]
机构
[1] Inha Univ, Dept Chem Engn, Inchon 402751, South Korea
关键词
Steam plasma; Perfluorocompounds; Water plasma;
D O I
10.1016/j.surfcoat.2008.06.023
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Research to find out an optimum decomposition process for CF4, one of the most stable gases among PFCs, have conducted with the steam plasma processing which elevates decomposition rate for high reactivity of steam itself. Before performing experiment, thermodynamic equilibrium calculations are done for the condition of 1atm and 300K-5000K by a software program to check the concentration based on the composition at equilibrium. CF4 is injected at atmospheric pressure and analyzed quantitatively and qualitatively by using GC (Gas Chromatography). HF (hydrogen fluoride), a byproduct, is extracted from the device by a vacuum aspirator and changed into fluorite or others as it passes through scrubbers containing NaOH (sodium hydroxide) and CaCO3 (calcium carbonate). We Study the effects of reaction time, quenching condition, additive gas dilution. input power, and etc. on decomposition of CF4 and achieve more than 90% of the CF4 removal rate. (C) 2008 Elsevier B.V. All rights reserved.
引用
收藏
页码:5280 / 5283
页数:4
相关论文
共 15 条
[1]  
[Anonymous], EUR SEMICON
[2]  
Boulos M I, 1994, THERMAL PLASMAS
[3]  
Grill A., 1994, COLD PLASMA MAT FABR, DOI DOI 10.1109/9780470544273
[4]  
*GTT TECHN, CHEMS SOFTW PROGR VE
[5]   Innovative surface wave plasma reactor technique for PFC abatement [J].
Hartz, CL ;
Bevan, JW ;
Jackson, MW ;
Wofford, BA .
ENVIRONMENTAL SCIENCE & TECHNOLOGY, 1998, 32 (05) :682-687
[6]  
Houghton J.T., 1996, SCI CLIMATE CHANGE
[7]  
KUNIHIHIKO K, 1993, JPN J APPL PHYS, V36, P5274
[8]  
Langan J, 1996, SOLID STATE TECHNOL, V39, P115
[9]   The anti-psychiatry approach reexamined through the work of Michel de Certeau [J].
Marion-Veyron, R .
EVOLUTION PSYCHIATRIQUE, 2004, 69 (01) :113-127
[10]  
MOCELLA MT, 1997, MATER RES SOC S P, V477, P29