Strong effect of Cu concentration on the reaction between lead-free microelectronic solders and Ni

被引：73

作者：

Ho, CE ^{[1
]}

Lin, YL ^{[1
]}

Kao, CR ^{[1
]}

机构：

[1] Natl Cent Univ, Dept Chem & Mat Engn, Chungli 32054, Taiwan

来源：

CHEMISTRY OF MATERIALS | 2002年 / 14卷 / 03期

关键词：

D O I：

10.1021/cm010639h

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

A slight change in the Cu concentration in the Sn-Ag-Cu solders can make a big difference in the strength of a solder joint in microelectronic packages. It was shown that (Ni1-xCux)(3)Sn-4 formed at the interface when Sn-3.9Ag-0.2Cu (wt%) solder was reacted with Ni and (Cu1-yNiy)(6)Sn-5 formed when Sn-3.9Ag-0.6Cu was reacted with Ni. The industry therefore must impose a very strict control over the Cu concentration to produce the desired intermetallic compound.

引用

页码：949 / +

页数：4

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