A process far fabrication of low-frequency, low-noise, low-power silicon JFETs for cryogenic operation has been developed. Commercially available silicon JFETs exhibit very high low frequency and 1/f noise at liquid nitrogen temperature (77K). We report on process optimization and effect of high temperature oxidation and drive-in process on noise performance of these devices. These silicon JFETs were designed for operation at 77K. In this paper, we report the noise performance and its relation to the well-known complex Oxygen-Vacancy (O-V) A-center that has a trap level of 0.18 eV below the conduction band. These devices were developed for use in the photo-diode assembly of NASAs Gravity Probe B (GP-B) mission telescope.