Observations of the spontaneous growth of tin whiskers on tin-manganese alloy electrodeposits

被引：58

作者：

Chen, K ^{[1
]}

Wilcox, GD ^{[1
]}

机构：

[1] Univ Loughborough, Inst Polymer Technol & Mat Engn, Loughborough LE11 3TU, Leics, England

来源：

PHYSICAL REVIEW LETTERS | 2005年 / 94卷 / 06期

关键词：

D O I：

10.1103/PhysRevLett.94.066104

中图分类号：

O4 [物理学];

学科分类号：

0702 ;

摘要：

The spontaneous growth of tin whiskers on electrodeposited tin-manganese alloy coatings has been observed. This growth is distinct from any previously reported whisker growth on either pure tin or other tin-based alloy electrodeposits. It has an extremely short incubation period of a few hours only, followed by a spectacularly rapid and profuse growth. During the whole period of whisker growth, the tin-manganese electrodeposits were found to be in a tensile residual stress state. This rules out the commonly accepted explanation of a compressive stress as the driving force for tin whisker growth.

引用

页数：4

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