Thermal management methods for compact high power LED Arrays

The package and system level temperature distributions of a high power (> 1W) light emitting diode (LED) array has been investigated using numerical heat flow models. For this analysis, a thermal resistor network model was combined with a 3D finite element submodel of an LED structure to predict system and die level temperatures. The impact of LED array density, LED power density, and active versus passive cooling methods on device operation were calculated. In order to help understand the role of various thermal resistances in cooling such compact arrays, the thermal resistance network was analyzed in order to estimate the contributions from materials as well as active and passive cooling schemes. An analysis of thermal stresses and residual stresses in the die are also calculated based on power dissipation and convection heat transfer coefficients. Results show that the thermal stress in the GaN layer are compressive which can impact the band gap and performance of the LEDs.