Quick prototyping of flip chip assembly with MEMS

被引：17

作者：

Irwin, R ^{[1
]}

Zhang, W ^{[1
]}

Harsh, K ^{[1
]}

Lee, YC ^{[1
]}

机构：

[1] Univ Colorado, Boulder, CO 80309 USA

来源：

1998 IEEE RADIO AND WIRELESS CONFERENCE PROCEEDINGS - RAWCON 98 | 1998年

关键词：

MEMS; flip-chip; thermosonic bonding; transfer bonding;

D O I：

10.1109/RAWCON.1998.709194

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 [电气工程]; 0809 [电子科学与技术];

摘要：

This paper describes a process to transfer Microelectromechanical Systems (MEMS) devices to a secondary substrate using flip-chip thermosonic bonding. A standard wire-bonding machine was used to place similar to 100-mu m bumps on unreleased MEMS chiplets. The bumped chiplet was then flip-chip bonded to a secondary substrate containing a microwave coplanar wave-guide (CPW). After bonding, the entire assembly was run through the MEMS release process, after which the MEMS host substrate was removed. The thermosonic bonding was a very reliable prototyping tool with a 100% bonding yield. The transfer process can be used with any MEMS that can be wire bonded. The process can also be applied to a variety of applications.

引用

页码：293 / 296

页数：4