Liquid-phase deposition of low-Kk organic silicon-oxide films

被引:8
作者
Usami, K [1 ]
Sugahara, S [1 ]
Sumimura, K [1 ]
Matsumura, M [1 ]
机构
[1] Tokyo Inst Technol, Meguro Ku, Tokyo 1528550, Japan
来源
LOW-DIELECTRIC CONSTANT MATERIALS IV | 1998年 / 511卷
关键词
D O I
10.1557/PROC-511-27
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Low-K silica films were grown from the liquid phase using methyl-triethoxy-silane. Physical and chemical properties were investigated together with electronic properties. The film had dense methyl groups and showed insulating characteristics even under as-grown conditions. The dielectric constant, low-field resistivity and breakdown field-strength were 3.6, 10(13)Omega cm and 1MV/cm, respectively, for the as-grown film. They were improved to 2.6, more than 10(15)Omega cm and more than 3MV/cm, respectively, after 300 degrees C vacuum annealing.
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页码:27 / 32
页数:6
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