Experimental investigation on interfacial adhesion in microelectronic assemblies

被引：3

作者：

Dai, X ^{[1
]}

Brillhart, MV ^{[1
]}

Ho, PS ^{[1
]}

机构：

[1] Univ Texas, Lab Interconnect & Packaging, PRC, MER, Austin, TX 78712 USA

来源：

ELECTRONIC PACKAGING MATERIALS SCIENCE X | 1998年 / 515卷

关键词：

D O I：

10.1557/PROC-515-15

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, we report recent studies on interface adhesion in flip-chip packaging. The adhesion energies of underfill interfaces found in typical flip-chip packaging applications are characterized and presented using a fracture-mechanics approach. The effects of underfill formulations and changes in polymer top-layer on PCB and chip passivation are also evaluated. The effects of underfill organosilane content, substrate surface chemistry and morphology, and underfill filler content are discussed in terms of fundamental mechanisms of adhesion.

引用

页码：15 / 22

页数：8