Composite plating of Sn-Ag alloys for Pb-free soldering

被引：23

作者：

Fujiwara, Y ^{[1
]}

Enomoto, H

Nagao, T

Hoshika, H

机构：

[1] Osaka Municipal Tech Res Inst, Joto Ku, Osaka 5368553, Japan

[2] Kansai Univ, Grad Student Mat Sci & Engn, Suita, Osaka 5648680, Japan

[3] Kansai Univ, Fac Engn, Suita, Osaka 5648680, Japan

来源：

SURFACE & COATINGS TECHNOLOGY | 2003年 / 169卷

关键词：

Ag nanoparticle; solderable coating; Sn-Ag eutectic alloy; composite plating; Pb-free solder;

D O I：

10.1016/S0257-8972(03)00169-5

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

The existence of Ag nanoparticles in the Sn-Ag composite plating electrolytes was confirmed from the UV-vis spectra using the surface plasmon peak. Wetting speed of the molten Sn-Ag solder to the Sn-Ag alloy-plated specimen by the composite plating was higher than that to the Sn-plated one. Solder bond strength of the Sn-Ag alloy-plated specimen was not decreased after the exposure to the humid environment, and was increased by the Ni underlayer. (C) 2003 Elsevier Science B.V. All rights reserved.

引用

页码：100 / 103

页数：4

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