Comparison of writing strategies subject to resist heating

被引:16
作者
Babin, S [1 ]
机构
[1] Etec Syst Inc, Hayward, CA 94545 USA
来源
18TH ANNUAL SYMPOSIUM ON PHOTOMASK TECHNOLOGY AND MANAGEMENT | 1998年 / 3546卷
关键词
electron lithography; resist heating; writing strategy;
D O I
10.1117/12.332875
中图分类号
O43 [光学];
学科分类号
070207 ; 0803 ;
摘要
During electron beam (e-beam) exposure, the temperature of the resist varies locally, causing critical dimension distortion. An experimental comparative study of resist heating at 50 kV for a number of writing strategies was made. Exposure, materials, and processing were equal; the same e-beam column was used, but beam deflection was modified so that raster scanning could be compared to vector scan beam (VSB) exposure at high throughput. These strategies were compared for single-pass and four-pass exposures. Simulations of temperature rise were done using the TEMPTATION (Temperature simulation) software tool. The maximum temperature rise was 38 degrees C for 614-degrees m wide raster exposure, while over 220 degrees C for VSB exposure. Good agreement of simulation and experiment was found. A 16% effective dose change due to resist heating was found at full coverage, single-pass exposure, while in VSB, this value was over 200%. These results indicate that raster writing has an advantage over VSB exposures with regard to resist heating.
引用
收藏
页码:389 / 397
页数:9
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