Realization of ultra fine pitch traces on LCP substrates

被引：15

作者：

Dean, Robert Neal, Jr. ^{[1
]}

Weller, Jennifer ^{[1
]}

Bozack, Mike J. M. J. ^{[1
]}

Rodekohr, Chad L. ^{[1
]}

Farrell, Brian ^{[2
]}

Jauniskis, Linas ^{[2
]}

Ting, Joseph ^{[2
]}

Edell, David J. ^{[3
]}

Hetke, Jamille F. ^{[4
,5
]}

机构：

[1] Auburn Univ, Auburn, AL 36849 USA

[2] Foster Miller Inc, Waltham, MA 02451 USA

[3] InnerSea Technol Inc, Bedford, MA 01730 USA

[4] Univ Michigan, Dept Elect Engn & Comp Sci, Ann Arbor, MI 48109 USA

[5] NeuroNexus Technol Inc, Ann Arbor, MI 48108 USA

来源：

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES | 2008年 / 31卷 / 02期

关键词：

liquid crystal polymer (LCP); packaging; ultra fine pitch;

D O I：

10.1109/TCAPT.2008.916790

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Liquid crystal polymer (LCP) is being utilized in a variety of applications that could benefit from the realization of ultra fine pitch conductive traces on the surface of the LCP substrate. LCP has unique chemical properties that not only benefit the intended application, but can also be exploited to realize ultra fine pitch traces. Through a series of experiments, it was discovered that a thin film of Ti can form TiC with the surface of an Ar ion ablated LCP substrate. This layer then provides sufficient adhesion for other metals to be deposited so that ultra fine pitch traces can be patterned. Using this process, 10 mu m wide traces on a 20 mu m pitch with high yield were demonstrated and analyzed. Smaller feature size test structures were also demonstrated.

引用

页码：315 / 321

页数：7

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