The behavior of a crack in functionally graded piezoelectric/piezomagnetic materials under anti-plane shear loading

In this paper, the behavior of a crack in functionally graded piezoelectric/piezomagnetic materials subjected to an anti-plane shear loading is investigated. To make the analysis tractable, it is assumed that the material properties vary exponentially with the coordinate parallel to the crack. By using a Fourier transform, the problem can be solved with the help of a pair of dual integral equations in which the unknown variable is the jump of the displacements across the crack surfaces. These equations are solved using the Schmidt method. The relations among the electric displacement, the magnetic flux and the stress field near the crack tips are obtained. Numerical examples are provided to show the effect of the functionally graded parameter on the stress intensity factors of the crack.