Advanced packaging yields higher performance and reliability in power electronics

被引：23

作者：

Bayerer, Reinhold ^{[1
]}

机构：

[1] Infineon Technol AG, D-59581 Warstein, Germany

来源：

MICROELECTRONICS RELIABILITY | 2010年 / 50卷 / 9-11期

关键词：

D O I：

10.1016/j.microrel.2010.07.016

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

080906 [电磁信息功能材料与结构]; 082806 [农业信息与电气工程];

摘要：

Power density of power electronics will continue to grow. It is always supported by progress in power semiconductors. Further significant loss reduction of IGBT and diodes becomes possible if power circuit design improves with respect to electro-dynamic performance. Efforts to improve cooling for better power dissipation out of smaller volumes appear to be disadvantageous in comparison to increase of junction temperature. The direction of increasing junction temperature is most effective for air cooled systems as well as liquid cooled systems with high ambient temperature. To enable long life time of modules under higher operation temperature heavy copper wire bonding and diffusion soldering of chips are presented to fulfill the requirements. New chip technologies with integrated heat buffers ensure transient thermal capability for shrunk power chips. (C) 2010 Elsevier Ltd. All rights reserved.

引用

页码：1715 / 1719

页数：5