Microstructure coarsening during static annealing of 60Sn4OPb solder joints: I stereology

被引：22

作者：

Jung, K ^{[1
]}

Conrad, H ^{[1
]}

机构：

[1] N Carolina State Univ, Dept Mat Sci & Engn, Raleigh, NC 27695 USA

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2001年 / 30卷 / 10期

关键词：

solder joints; phase size distribution; positive skew; log-normal function; time invariant; shape factor;

D O I：

10.1007/s11664-001-0114-z

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The phase size distributions (PSDs) of the Sn, Pb, and the combined Pb and Sn phases, and the shape factor delta were determined for as-reflowed 6OSn40Pb solder joints and following their annealing at 50 degreesC to 150 degreesC. The PSDs in all cases had a positive skew which was approximated by a log-normal function. The PSDs were time invariant and were in accord with the Bitti and Nunzio model for phase coarsening. The shape factor, delta, decreased with the mean of the combined Pb and Sn phase size, and with temperature. Whether or not delta affects the PSDs is not clear.

引用

页码：1294 / 1302

页数：9

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