A crystallographic mechanism for fatigue crack propagation through grain boundaries

A crystallographic model is proposed which takes into account both crack-plane twist and tilt effects on crack retardation at grain boundaries. The twist and tilt angles of the crack-plane deflection at a grain boundary are the key factors that control the path and growth rate of a short crack. Because of crack-plane twist, the area between the traces on the grain-boundary plane of the crack planes across the boundary has to be fractured in order for the crack to propagate through the boundary. This presents significant resistance to crack growth. As the area to be fractured increases with the extent of crack growth beneath the surface of observation, the grain boundary could still resist crack growth after the crack tip has passed the grain boundary on the surface, until the crack propagates through the whole boundary below the surface. A grain boundary with a large twist component could cause a short crack to arrest or branch. Studies of short fatigue crack growth in an AI-LI 8090 alloy plate provide evidence that supports the model. (C) 2000 Published by Elsevier Science Ltd on behalf of Acta Metallurgica Inc.