An intermetallic study of solder joints with Sn-Ag-Cu lead-free solder

被引：10

作者：

Chan, CF ^{[1
]}

Lahiri, SK ^{[1
]}

Yuan, P ^{[1
]}

How, JBH ^{[1
]}

机构：

[1] Motorola Elect Pte Ltd, Singapore 569059, Singapore

来源：

PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE | 2000年

关键词：

D O I：

10.1109/EPTC.2000.906352

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper focuses on the intermetallics study of reliability tested solder joints between the Sn-3.5Ag-0.75Cu lead-free solder balls and Sn-plated Cu pads on molded BGAs. In the solder joints, eta phase (Cu6Sn5) was the initial intermetallic observed on the Cu substrate, followed by epsilon phase (Cu3Sn) between eta and Cu. This paper described observations on intermetallic thickness and its growth over the anneal timeframe. It also covers the impacts of reliability tests on joint integrity and mechanical failure mode. The results obtained were compared against Sn-36Pb-2Ag solder in order to provide a more comprehensive understanding of the Sn-Ag-Cu lead-free solder.

引用

页码：72 / 80

页数：9

共 7 条

[1]

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[2]

PAN TY, 1997, EEP ASME, V192, P1347

[3]

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[4]

RICHARDS BP, 1999, ANAL CURRENT STATUS

[5]

ROEDER JF, 1992, P 7 EL MAT PROC C EL, P225

[6] SOLID-STATE INTERMETALLIC COMPOUND GROWTH BETWEEN COPPER AND HIGH-TEMPERATURE, TIN-RICH SOLDERS .1. EXPERIMENTAL-ANALYSIS [J].

VIANCO, PT ;

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[7] MICROSTRUCTURE EVOLUTION OF EUTECTIC SN-AG SOLDER JOINTS [J].

YANG, W ;

MESSLER, RW ;

FELTON, LE .

JOURNAL OF ELECTRONIC MATERIALS, 1994, 23 (08) :765-772

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