Micro-jet printing of polymers for electronics manufacturing

Ink-jet/micro-jet printing methods are being developed for direct writing of a variety of materials for electronics and optoelectronics manufacturing. Advantages offered by this approach for micro-element fabrication and adhesive joining include precise volumetric control of dispensed material, data-driven flexibility, low cost, high speed and low environmental impact. Custom thermo-setting and thermoplastic systems have been developed for the printing of optical interconnects, dielectric elements and coatings, adhesives and thick film resistors, utilizing a drop-on-demand piezoelectric print head operable at temperatures up to 300 degrees C. Reviewed here are examples of printing of: (a) adhesives for component bonding; (b) dielectrics for overcoating and conformal microelectronics fabrication; (c) thick-film resistors; (d) micro-optical components; and (e) polymers filled with oxides and fluorescing materials. Manufacturing applications potentially addressable to advantage by this method include flip-chip die attach, chip-scale microelectronics packaging, under filling & overcoating, along with fabrication of passive devices, disk drive heads and flat panel displays.