Plasmonics - the missing link between nanoelectronics and microphotonics

被引:48
作者
Brongersma, M. L. [1 ]
Zia, R. [1 ]
Schuller, J. A. [1 ]
机构
[1] Stanford Univ, Geballe Lab Adv Mat, Stanford, CA 94305 USA
来源
APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING | 2007年 / 89卷 / 02期
关键词
Electron Beam Lithography; Plasmonic Waveguide; Metallic Nanostructures; Waveguide Width; Plasmonic Device;
D O I
10.1007/s00339-007-4151-1
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Plasmonics is an exciting new device technology that has recently emerged. It exploits the unique optical properties of metallic nanostructures to enable routing and manipulation of light at the nanoscale. A tremendous synergy can be attained by integrating plasmonic, electronic, and conventional dielectric photonic devices on the same chip and taking advantage of the strengths of each technology. We will provide a perspective on future directions and possibilities for integrating plasmonic devices on a Si chip.
引用
收藏
页码:221 / 223
页数:3
相关论文
共 7 条
  • [1] BANERJEE K, 1996, TECH DIG IEDM, V65
  • [2] BOHR M, 1995, TECH DIG IEDM, V241
  • [3] Raether H, 1988, Surface Plasmons, V111
  • [4] Effects of next-nearest-neighbor interactions on the orientation dependence of step stiffness: Reconciling theory with experiment for Cu(001)
    Stasevich, TJ
    Einstein, TL
    Zia, RKP
    Giesen, M
    Ibach, H
    Szalma, F
    [J]. PHYSICAL REVIEW B, 2004, 70 (24) : 1 - 7
  • [5] Geometries and materials for subwavelength surface plasmon modes
    Zia, R
    Selker, MD
    Catrysse, PB
    Brongersma, ML
    [J]. JOURNAL OF THE OPTICAL SOCIETY OF AMERICA A-OPTICS IMAGE SCIENCE AND VISION, 2004, 21 (12) : 2442 - 2446
  • [6] Near-field characterization of guided polariton propagation and cutoff in surface plasmon waveguides
    Zia, Rashid
    Schuller, Jon A.
    Brongersma, Mark L.
    [J]. PHYSICAL REVIEW B, 2006, 74 (16):
  • [7] Plasmonics: the next chip-scale technology
    Zia, Rashid
    Schuller, Jon A.
    Chandran, Anu
    Brongersma, Mark L.
    [J]. MATERIALS TODAY, 2006, 9 (7-8) : 20 - 27