The texture of copper electrodeposits changes from the orientation that places the lowest energy crystal facets parallel to the substrate under a condition of low ion concentration adjacent to the deposit, to the orientation that places the higher energy crystal facets parallel to the substrate as the ion concentration adjacent to the deposit increases. The copper electrodeposits have peculiar surface morphologies and microstructures depending on their textures, which in turn may affect their mechanical properties even when they are obtained in similar electrolysis conditions. The electrodeposits undergo recrystallization, when annealed. The recrystallization texture may be different from the original deposit texture. These phenomena have been discussed.