Microfabrication using one-step LPCVD porous polysilicon films

被引：11

作者：

Dougherty, GM ^{[1
]}

Sands, TD

Pisano, AP

机构：

[1] Univ Calif Berkeley, Berkeley Sensor & Actuator Ctr, Dept Mat Sci & Engn, Berkeley, CA 94720 USA

[2] Univ Calif Berkeley, Berkeley Sensor & Actuator Ctr, Dept Engn Mech, Berkeley, CA 94720 USA

来源：

JOURNAL OF MICROELECTROMECHANICAL SYSTEMS | 2003年 / 12卷 / 04期

关键词：

encapsulation; filters; hollow shells; low-pressure chemical vapor deposition (LPCVD); membranes; micromachining; permeable polysilicon; porous polysilicon; sealing; thin films;

D O I：

10.1109/JMEMS.2003.811730

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A simple, one-step LPCVD process was recently reported to allow the repeatable fabrication of polycrystalline silicon (polysilicon) thin films containing through-pores measuring 10-50 nm in diameter, as-deposited, with no additional processing steps required. This paper describes methods for using this one-step porous polysilicon material to quickly and easily fabricate structures of interest to MEMS designers. Among the structures presented are hermetically sealed diaphragms, hollow tube and shell structures, substrate-aligned membranes over one square centimeter in area ("supermembranes"), and permeable fluidic microchannels on silicon and quartz substrates.

引用

页码：418 / 424

页数：7

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