TiAlN coatings deposited by triode magnetron sputtering varying the bias voltage

被引:123
作者
Devia, D. M. [1 ,2 ]
Restrepo-Parra, E. [1 ]
Arango, P. J. [1 ]
Tschiptschin, A. P. [3 ]
Velez, J. M. [2 ]
机构
[1] Univ Nacl Colombia, Lab Fis Plasma, Manizales, Caldas, Colombia
[2] Univ Nacl Colombia Sede Medellin, Mat Lab, Sede Medellin, Antioquia, Colombia
[3] Univ Sao Paulo, Escola Politecn, Dept Engn Met & Mat, Sao Paulo, Brazil
关键词
Titanium aluminum nitride; Crystallography; Microstructure; Hardness; Adhesion; MECHANICAL-PROPERTIES; SUBSTRATE-TEMPERATURE; NITRIDE COATINGS; WEAR-RESISTANCE; ION IRRADIATION; (TIAL)N FILMS; N COATINGS; THIN-FILMS; TIN; TITANIUM;
D O I
10.1016/j.apsusc.2011.02.027
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070305 [高分子化学与物理];
摘要
TiAlN films were deposited on AISI O1 tool steel using a triode magnetron sputtering system. The bias voltage effect on the composition, thickness, crystallography, microstructure, hardness and adhesion strength was investigated. The coatings thickness and elemental composition analyses were carried out using scanning electron microscopy (SEM) together with energy dispersive X-ray (EDS). The re-sputtering effect due to the high-energy ions bombardment on the film surface influenced the coatings thickness. The films crystallography was investigated using X-ray diffraction characterization. The X-ray diffraction (XRD) data show that TiAlN coatings were crystallized in the cubic NaCl B1 structure, with orientations in the {111}, {200} {220} and {311} crystallographic planes. The surface morphology (roughness and grain size) of TiAlN coatings was investigated by atomic force microscopy (AFM). By increasing the substrate bias voltage from -40 to -150 V, hardness decreased from 32 GPa to 19 GPa. Scratch tester was used for measuring the critical loads and for measuring the adhesion. (C) 2011 Elsevier B. V. All rights reserved.
引用
收藏
页码:6181 / 6185
页数:5
相关论文
共 46 条
[1]
Deposition of TiAlN coatings using reactive bipolar-pulsed direct current unbalanced magnetron sputtering [J].
Barshilia, Harish C. ;
Yogesh, K. ;
Rajam, K. S. .
VACUUM, 2008, 83 (02) :427-434
[2]
Residual stresses in titanium nitride thin films deposited by direct current and pulsed direct current unbalanced magnetron sputtering [J].
Benegra, M ;
Lamas, DG ;
de Rapp, MEF ;
Mingolo, N ;
Kunrath, AO ;
Souza, RM .
THIN SOLID FILMS, 2006, 494 (1-2) :146-150
[3]
Effect of target frequency, bias voltage and bias frequency on microstructure and mechanical properties of pulsed DC CFUBM sputtered TiN coating [J].
Bhaduri, Debajyoti ;
Ghosh, Arnab ;
Gangopadhyay, Soumya ;
Paul, Soumitra .
SURFACE & COATINGS TECHNOLOGY, 2010, 204 (21-22) :3684-3697
[4]
STUDY OF TUNGSTEN SPUTTERED FILMS WITH LOW NITROGEN-CONTENT [J].
CASTANHO, J ;
CAVALEIRO, A ;
VIEIRA, MT .
VACUUM, 1994, 45 (10-11) :1051-1053
[5]
Characterization and temperature controlling property of TiAlN coatings deposited by reactive magnetron co-sputtering [J].
Chen, J. T. ;
Wang, J. ;
Zhang, F. ;
Zhang, G. A. ;
Fan, X. Y. ;
Wu, Z. G. ;
Yan, P. X. .
JOURNAL OF ALLOYS AND COMPOUNDS, 2009, 472 (1-2) :91-96
[6]
Reactive magnetron sputtering deposition of TiN films .1. Influence of the substrate temperature on structure, composition and morphology of the films [J].
Combadiere, L ;
Machet, J .
SURFACE & COATINGS TECHNOLOGY, 1997, 88 (1-3) :17-27
[7]
Raman microscopic studies of residual and applied stress in PVD hard ceramic coatings and correlation with X-ray diffraction (XRD) measurements [J].
Constable, CP ;
Lewis, DB ;
Yarwood, J ;
Münz, WD .
SURFACE & COATINGS TECHNOLOGY, 2004, 184 (2-3) :291-297
[8]
Corrosion of TiN, (TiAl)N and CrN hard coatings produced by magnetron sputtering [J].
Cunha, L ;
Andritschky, M ;
Rebouta, L ;
Silva, R .
THIN SOLID FILMS, 1998, 317 (1-2) :351-355
[9]
Abrasive wear resistance of Ti1-xAlxN hard coatings deposited by a vacuum arc system with lateral rotating cathodes [J].
Ding, Xing-zhao ;
Bui, C. T. ;
Zeng, X. T. .
SURFACE & COATINGS TECHNOLOGY, 2008, 203 (5-7) :680-684
[10]
GROWTH OF THIN-FILMS WITH PREFERENTIAL CRYSTALLOGRAPHIC ORIENTATION BY ION-BOMBARDMENT DURING DEPOSITION [J].
ENSINGER, W .
SURFACE & COATINGS TECHNOLOGY, 1994, 65 (1-3) :90-105