Valveless pumping using traversing vapor bubbles in microchannels

被引:117
作者
Jun, TK [1 ]
Kim, CJ [1 ]
机构
[1] Univ Calif Los Angeles, Dept Mech & Aerosp Engn, Los Angeles, CA 90095 USA
关键词
D O I
10.1063/1.367419
中图分类号
O59 [应用物理学];
学科分类号
摘要
Pumping of fluids in microchannels using the movement of a single or multiple vapor bubble(s) is proposed, analyzed, and demonstrated. The pumping mechanism requires no micromechanical moving parts for actuation by utilizing asymmetric heating which creates a variation in vapor pressure and surface tension due to the healer-induced temperature gradient along the channel. A heat and mass transfer analysis was performed to understand the pumping mechanism and estimate the pumping capability of the micropumping device. To verify the concept and our analysis, a pumping device with a transparent microchannel with a hydraulic diameter of 3.4 mu m was fabricated on a silicon wafer using surface micromachining. Experimental results with the first generation device have shown pumping of isopropanol at velocities as high as 160 mu m/s (0.5 nl/min flow rate) with a pressure head of approximately 800 Pa. (C) 1998 American Institute of Physics. [S0021-8979(98)08910-5].
引用
收藏
页码:5658 / 5664
页数:7
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