Preparation of TEM plan view sections on specific devices using the Tripod Polisher

被引：5

作者：

Benedict, JP ^{[1
]}

Anderson, RM ^{[1
]}

Klepeis, SJ ^{[1
]}

机构：

[1] IBM Corp, Hopewell Junction, NY 12533 USA

来源：

ELECTRON MICROSCOPY OF SEMICONDUCTING MATERIALS AND ULSI DEVICES | 1998年 / 523卷

关键词：

D O I：

10.1557/PROC-523-19

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Plan view or "top down" sections of specific sites for TEM analysis can be prepared by mechanically polishing the specimen with the Tripod Polisher. This technique produces plan view sections with a large area available for TEM analysis that encompasses the specific site. Because the sample is mechanically polished, the problem of surface topography due to non uniform thinning is minimized.

引用

页码：19 / 30

页数：12