Toward a more robust and accurate CEM fast integral equation solver for IC applications

被引:13
作者
Chew, WC [1 ]
Jiang, LJ
Chu, YH
Wang, GL
Chiang, IT
Pan, YCC
Zhao, JS
机构
[1] Univ Illinois, Ctr Computat Electromagnet, Urbana, IL 61801 USA
[2] Univ Illinois, Electromagnet Lab, Dept Elect & Comp Engn, Urbana, IL 61801 USA
[3] IBM Corp, Thomas J Watson Res Ctr, Yorktown Hts, NY 10589 USA
[4] Agilent Technol, Westlake Village, CA 91362 USA
[5] Intel Corp, Hillsboro, OR 97124 USA
[6] Madmax Opt, Hamden, CT 06518 USA
来源
IEEE TRANSACTIONS ON ADVANCED PACKAGING | 2005年 / 28卷 / 03期
关键词
fast real-time convolution; integral equation; lithography; method of moments (MoM); multilevel fast multipole algorithm (MLFMA);
D O I
10.1109/TADVP.2005.848665
中图分类号
T [工业技术];
学科分类号
08 [工学];
摘要
We review recent advances in fast algorithms for fast integral equation solvers that are useful for IC applications. We review fast solvers for Laplace's equation, which is about 10 times faster than the conventional fast multipole method. Then we review the physics of low-frequency electromagnetics, and the relevant low-frequency method of moments. We describe a fast solver that allows us to solve over one million unknowns on a workstation recently. In addition, we demonstrate the applications of these fast integral equation solvers to the lithography problem. In addition, we propose a scheme whereby we first characterize blocks of linear circuits with network S, Y, or Z parameters. Then a fast real-time convolution scheme is used to calculate the interaction of a linear circuit with nonlinear terminations such as transistors and diodes. Such a scheme requires no model-order reduction of the circuits.
引用
收藏
页码:449 / 464
页数:16
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