Transient cooling of electronics using phase change material (PCM)-based heat sinks

被引:396
作者
Kandasamy, Ravi
Wang, Xiang-Qi
Mujumdar, Arun S.
机构
[1] Natl Univ Singapore, Engn Sci Program, Singapore 119260, Singapore
[2] Natl Univ Singapore, Dept Mech Engn, Singapore 119260, Singapore
关键词
phase change materials; heat sink; electronics cooling; thermal management;
D O I
10.1016/j.applthermaleng.2007.06.010
中图分类号
O414.1 [热力学];
学科分类号
摘要
Use of a phase change material (PCM)-based heat sink in transient thermal management of plastic quad flat package (QFP) electronic devices was investigated experimentally and numerically. Results show that increased power inputs enhance the melting rate as well as the thermal performance of the PCM-based heat sinks until the PCM is fully melted. A three-dimensional computational fluid dynamics model was proposed to simulate the problem and demonstrated good agreement with experimental data. Results indicate the potential for PCM-based heat sinks for use in intermittent-use devices. (C) 2007 Elsevier Ltd. All rights reserved.
引用
收藏
页码:1047 / 1057
页数:11
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