Chip-package codesign for high-frequency circuits and systems

被引：6

作者：

Lin, J ^{[1
]}

机构：

[1] AT&T Bell Labs, Lucent Technol, Wireless Circuits & Syst Res Dept, Murray Hill, NJ 07974 USA

来源：

IEEE MICRO | 1998年 / 18卷 / 04期

关键词：

D O I：

10.1109/40.710868

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

When the need for high frequency combines with the demand for low-cost consumer electronics, the challenge of ensuring correctly functioning components becomes paramount. Focusing on chip-package codesign offers a solution.

引用

页码：24 / 32

页数：9

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