Experimental and Analytical Studies on the High Cycle Fatigue of Thin Film Metal on PET Substrate for Flexible Electronics Applications

被引：32

作者：

Alzoubi, Khalid ^{[1
]}

Lu, Susan ^{[1
]}

Sammakia, Bahgat ^{[1
]}

Poliks, Mark ^{[2
]}

机构：

[1] SUNY Binghamton, Dept Syst Sci & Ind Engn, Binghamton, NY 13902 USA

[2] SUNY Binghamton, Dept Chem, Binghamton, NY 13902 USA

来源：

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY | 2011年 / 1卷 / 01期

关键词：

Flexible electronics; flexible substrates; high cyclic bending fatigue; thin films; COPPER-FILMS; MECHANICAL-PROPERTIES; BEHAVIOR; DEFORMATION; DISPLAYS;

D O I：

10.1109/TCPMT.2010.2100911

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This paper addresses the behavior of thin-film metal coated flexible substrates under high cyclic bending fatigue loading. Polyethylene terephthalate (PET) and polyethylene naphthalate (PEN) are widely used substrates in the fabrication of microelectronic devices. Factors affecting the fatigue life of thin-film coated on a flexible PET substrates were studied, including thin-film thickness, film material, bending radius, temperature, and humidity. A series of experiments for sputter-deposited copper and aluminum coated on a PET substrate were conducted. Electrical resistance and crack growth rate were monitored during the experiments at specified time intervals. In addition, a finite element model was built to simulate the bending of thin-films on flexible substrate structure. Layered shell elements were used in the model. Stress intensity and stress distribution across the film were obtained and compared with the experiments. Initial results of copper-coated PET showed a great agreement between the model and the experimental results.

引用

页码：43 / 51

页数：9

共 18 条

[1] Bendable integrated circuits on plastic substrates by use of printed ribbons of single-crystalline silicon [J].

Ahn, Jong-Hyun ;

Kim, Hoon-Sik ;

Menard, Etienne ;

Lee, Keon Jae ;

Zhu, Zhengtao ;

Kim, Dae-Hyeong ;

Nuzzo, Ralph G. ;

Rogers, John A. .

APPLIED PHYSICS LETTERS, 2007, 90 (21)

[2] Fatigue failure in thin-film polycrystalline silicon is due to subcritical cracking within the oxide layer [J].

Alsem, DH ;

Stach, EA ;

Muhlstein, CL ;

Ritchie, RO .

APPLIED PHYSICS LETTERS, 2005, 86 (04) :041914-1

[3]

ALZOUBI K, 2009, ASME 2009 INTERPACK

[4] Electromechanical properties of transparent conducting substrates for flexible electronic displays [J].

Cairns, DR ;

Crawford, GP .

PROCEEDINGS OF THE IEEE, 2005, 93 (08) :1451-1458

[5]

Crawford GP, 2005, WILEY-SID SER DISPL, P1, DOI 10.1002/0470870508

[6] Fatigue behavior of thin Cu foils for flexible printed circuit board [J].

Han, Seungwoo ;

Seo, Kijeong ;

Kim, Wandoo ;

Lee, Hakjoo ;

Lee, Hyunwoo ;

Shin, Jaeho ;

Lee, Jaejoon .

ADVANCES IN NANOMATERIALS AND PROCESSING, PTS 1 AND 2, 2007, 124-126 :1369-+

[7] Deformation behavior of thin copper films on deformable substrates [J].

Hommel, M ;

Kraft, O .

ACTA MATERIALIA, 2001, 49 (19) :3935-3947

[8] Fatigue in thin films: lifetime and damage formation [J].

Kraft, O ;

Schwaiger, R ;

Wellner, P .

MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2001, 319 :919-923

[9] Mechanical properties of organic light-emitting thin films deposited on polymer-based barrier substrate: potential for flexible organic light-emitting displays [J].

Low, HY ;

Chua, SJ .

MATERIALS LETTERS, 2002, 53 (4-5) :227-232

[10] High cycle fatigue resistance and reliability assessment of flexible printed circuitry [J].

Martynenko, E ;

Zhou, W ;

Chudnovsky, A ;

Li, RS ;

Poglitsch, L .

JOURNAL OF ELECTRONIC PACKAGING, 2002, 124 (03) :254-259

← 1 2 →