The effect of rapid solidification on the structure, decomposition behavior, electrical and mechanical properties of the Sn-Cd binary alloys

被引:20
作者
Kamal, M [1 ]
El-Bediwi, AB
El-Ashram, T
机构
[1] Mansoura Univ, Fac Sci, Dept Phys, Mansoura, Egypt
[2] Suez Canal Univ, Fac Educ, Dept Phys, Port Said, Egypt
关键词
Microstructure; Mechanical Property; Thermal Analysis; Electronic Material; Differential Thermal Analysis;
D O I
10.1023/B:JMSE.0000012457.77041.c6
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A group of rapidly solidified Sn-Cd alloys has been prepared by a melt-spinning technique. X-ray diffraction, microstructure, and differential thermal analysis have been carried out. Young's modulus and internal friction have been measured, and the temperature dependence of resistivity has been evaluated. The results show a modification in both the microstructure and decomposition behavior. Also, an interesting connection between Young's modulus and the axial ratio (c/a) of the unit cell of the beta-Sn was found in which Young's modulus increases by increasing the axial ratio (c/a). It was found also that the internal friction increases on increasing the Cd concentration. (C) 2004 Kluwer Academic Publishers.
引用
收藏
页码:211 / 217
页数:7
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