A study on sintering and microstructure development of fritless silver thick film conductors

被引：75

作者：

Rane, S ^{[1
]}

Puri, V

Amalnerkar, D

机构：

[1] Ctr Mat Elect Technol, Pune 411008, Maharashtra, India

[2] Shivaji Univ, Dept Phys, Thick & Thin Film Device Lab, Kolhapur 416004, Maharashtra, India

来源：

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2000年 / 11卷 / 09期

关键词：

D O I：

10.1023/A:1008914424013

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Thick film materials have proved to possess economic processing and functional advantages over other technologies in high-volume production of miniaturized circuits. The development of a low-cost fritless silver paste with different binder composition is described in the present work. The effect of composition and firing temperature (700-900 degreesC) on the microstructure is also reported. The sheet resistivity and surface morphology of all the indigenously formulated Ag thick film pastes are compared with the imported (ESL) paste. The results suggest that the thick films can be fired at 700 degreesC instead of the conventional 900 degreesC firing temperature. (C) 2000 Kluwer Academic Publishers.

引用

页码：667 / 674

页数：8

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