Improving the critical current density in Bi-2223 wires via a reduction of the secondary phase content

被引：8

作者：

Huang, YB ^{[1
]}

Cai, XY

Holesinger, T

Maroni, VA

Yu, D

Parrella, R

Rupich, M

Hellstrom, E

Teplitsky, M

Venkataraman, K

Otto, A

Larbalestier, D

机构：

[1] Amer Supercond, Westborough, MA 01581 USA

[2] Univ Wisconsin, Ctr Appl Supercond, Madison, WI 53706 USA

[3] Los Alamos Natl Lab, Los Alamos, NM 87545 USA

[4] Argonne Natl Lab, Argonne, IL 60439 USA

来源：

IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY | 2003年 / 13卷 / 02期

关键词：

Bi-2223; tape; critical current density; high temperature superconductor; microstructure analysis;

D O I：

10.1109/TASC.2003.812067

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Progress in the performance of multifilamentary composite Bi-2223 wire fabricated at American Superconductor is reviewed. Critical current (I-c) performance of 175 A at 77 K and self-field and critical current density (J(c)) performance of 21.1 kA/cm(2) (77 K, 0.1 T perpendicular to the tape plane) have been measured for short samples of Bi-2223 wire (standard size is 0.21 x 4.0 x 100 mm). Microstructure analysis by SQUID magnetomtry, transmission XRD and TEM shows a large amount of residual 2211 intergrowth remaining in Bi-2223 grains. Residual 2212 intergrowth is seen to correlate with self-field J(c) at 77 K across a range of experimental samples, suggesting that higher levels,of performance will be achieved by further reducing residual 2212.

引用

页码：3038 / 3041

页数：4

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