Current status of EUV photoresists

被引:45
作者
Brainard, RL [1 ]
Cobb, J
Cutler, CA
机构
[1] Shipley Co Inc, Marlborough, MA 01752 USA
[2] DigitalDNA Labs, Austin, TX 78721 USA
关键词
extreme ultraviolet lithography; photoresist; resolution; line-edge roughness; photospeed; EUVL;
D O I
10.2494/photopolymer.16.401
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
The current status of EUV resists is reviewed based on performance studies of line edge roughness (LER), sensitivity, resolution and pattern transfer. A large variation in polymer molecular weight (2.9-33.5 K g/mol) is found to have little effect on LER. Dissolution properties such as unexposed film thickness loss (UFTL) are shown to have a large effect on LER. Increasing resist contrast and image contrast are shown to improve resist LER. Variation in base level within resists based on EUV-2D shows a clear trade-off between sensitivity and LER. Acid diffusion can play an important role in determining LER. Resist resolution and image transfer capabilities are also discussed.
引用
收藏
页码:401 / 410
页数:10
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