Surface contamination of bonding pads incapable of an wire bonding

被引：2

作者：

Watanabe, M ^{[1
]}

Tabuse, K ^{[1
]}

机构：

[1] Advantest Anal Lab Ltd, Gyoda City, Saitama 3610021, Japan

来源：

TWENTY THIRD IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM | 1998年

关键词：

D O I：

10.1109/IEMT.1998.731074

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The spatial distribution of contamination in micro-areas of bonding pads in IC and hybrid IC is evaluated and graphically visualized by a micro-reflectometer of polarized lights. Distributions of surface roughness, surface dielectric constant and the thickness of contaminant layers are calculated by theories of non-classical reflectance of polarized lights. It is evidenced that the reflectance ratio R-s/R-p of s- and p-lights is an excellent indicator of surface contamination, and its variation is proportional to weakening of the bond strength. It is concluded that the present system can be utilized at production lines of micro-devices to monitor accidental or inevitable pollution on micro-parts like bonding pads because of its quickness, cleanliness, compactness as well as its low price.

引用

页码：187 / 193

页数：3