Surface tension and wetting behaviour of molten Cu-Sn alloys

被引：46

作者：

Amore, Stefano ^{[1
,2
]}

Ricci, Enrica

Lanata, Tiziana ^{[3
]}

Novakovic, Rada

机构：

[1] Univ Genoa, DCCI, I-16146 Genoa, Italy

[2] INSTM, I-16146 Genoa, Italy

[3] Univ Genoa, DIAM, I-16145 Genoa, Italy

来源：

JOURNAL OF ALLOYS AND COMPOUNDS | 2008年 / 452卷 / 01期

关键词：

surface tension; wetting; lead-free solders;

D O I：

10.1016/j.jallcom.2007.01.178

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

The surface and interfacial properties of the Cu-Sn system as basic system of the multicomponent alloys proposed as lead-free soldering materials have been studied. The surface tension of the Cu-Sn system has been measured over the whole composition range by using the sessile drop method in the temperature range between 430 and 1300 K. The results obtained are compared with the available literature data and with theoretical values calculated by the compound formation model (CFM) and quasi-chemical approximation for regular solutions (QCA). The study of the wetting behaviour of Cu-Sn on a metal substrate has been performed by measuring the contact angles of four Sn-rich alloys on a pure Ni-substrate and by the metallographic characterization of the solder/Ni interfaces. (c) 2007 Elsevier B.V. All rights reserved.

引用

页码：161 / 166

页数：6

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