High-performance substrate based on a highly filled thermoplastic polymer

Purpose - The purpose of this paper is to investigate and present the properties of a new substrate material based on thermoplastic polymers (so-called LuVo Board) for high-frequency applications. Design/methodology/approach - The thermal, mechanical and electrical properties of a new thermoplastic substrate are investigated and compared to conventional substrates for printed circuit board (PCB) applications. Findings - The new LuVo Board exhibits similar properties to commercially available high-performance substrates. The main advantage of the LuVo Board is a reduction of manufacturing costs in comparison to conventional substrates, as a highly automated manufacturing process can be employed. Moreover, the LuVo Board exhibits some further advantages: the material is inherently flame resistant and can be thermally shaped after the assembly process. Originality/value - This paper presents an entirely new thermoplastic substrate, which can be employed in high-frequency applications. In comparison to standard materials, a further advantage of the thermoplastic substrate is lower production costs.