Application of refrigeration system in electronics cooling

被引:39
作者
Nnanna, AGA [1 ]
机构
[1] Pudue Univ Calumet, Dept Mech Engn, Hammond, IN 46323 USA
关键词
vapor compression refrigeration system; electronics cooling; TXV; high heat flux electronics; and evaporator cold plate;
D O I
10.1016/j.applthermaleng.2005.04.012
中图分类号
O414.1 [热力学];
学科分类号
摘要
An experimental investigation of the transient response of the vapor compression refrigeration (VCR) system to rapid change in evaporator (simulated electronics) heat load is presented. In this study.. the VCR system is designed and constructed specifically for applications to cool high heat flux electronics and high-end computers. Temperature and pressure data were measured at pre-selected locations to study the behavior of the refrigeration system to alterations in evaporator heat load. Results show that the VCR system maintains the junction temperature of the simulated electronics at a much lower temperature compared to conventional air-cooling systems. The maximum temperature was registered near the exit of the evaporator cold plate. Experimental evidence shows an oscillation in temperature with time at the evaporator cold plate and the thermostatic expansion valve prior to attaining steady-state condition, and that the thermostatic expansion valve and the evaporator time constants are equal; and have a value of 70 s. Also, for analytical and numerical models of heat transfer in evaporator cold plate, results shows that the assumption of one-dimensional temperature distribution is unrealistic. (c) 2005 Elsevier Ltd. All rights reserved.
引用
收藏
页码:18 / 27
页数:10
相关论文
共 21 条
[1]  
AFLEKT K, 2002, AM CHEM SOC, V38, P66
[2]  
AMIT K, 2002, INT C THERM PHEN, P403
[3]   Experimental evaluation of electronic and thermostatic expansion valves performances using R22 and R407C [J].
Aprea, C ;
Mastrullo, R .
APPLIED THERMAL ENGINEERING, 2002, 22 (02) :205-218
[4]  
APREA C, 1997, INT J MEAS, V21, P65
[5]  
BEJAN A, 1988, MECH ENG, V110, P58
[6]   Thermodynamic optimization of cooling techniques for electronic packages [J].
Bejan, A ;
Ledezma, GA .
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 1996, 39 (06) :1213-1221
[7]  
Boles M.A., 2007, Thermodynamics: an engineering approach, VMcGraw Hill
[8]  
BROERSEN PMT, 1980, ASME T, V1, P130
[9]  
DANNING P, 1992, J REFRIGERATION, P52
[10]  
GREEN RH, 1992, INT REFR C EN EFF NE