A fully-dry PECVD-oxynitride process for microGC column fabrication

被引：6

作者：

Agah, M ^{[1
]}

Wise, KD ^{[1
]}

机构：

[1] Univ Michigan, Engn Res Ctr Wireless Integrated MicroSyst, Ann Arbor, MI 48109 USA

来源：

MEMS 2005 MIAMI: TECHNICAL DIGEST | 2005年

关键词：

D O I：

10.1109/MEMSYS.2005.1454044

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper reports the development of a fully-dry process for fabricating ultra-low-mass separation columns for a micro gas chromatograph (mu GC). This new CMOS-compatible buried-channel technique utilizes stress-free PECVD oxynitride films having a deposition rate of about 1 mu m/min and an etch rate less than 200 angstrom/min in SF6 plasma to form 25cm-long 65 mu m-ID semicircular columns on a 6mm square chip. In vacuum, such columns can achieve 100 degrees C at less than 10mW with a thermal time constant under 1 min.

引用

页码：774 / 777

页数：4

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