X-ray exposures of electro-deposited photoresist for conformal lithography on corrugated surfaces

被引：6

作者：

Hartley, FT ^{[1
]}

Malek, CK ^{[1
]}

Nguyen, S ^{[1
]}

机构：

[1] CALTECH, Jet Prop Lab, Pasadena, CA 91109 USA

来源：

EMERGING LITHOGRAPHIC TECHNOLOGIES II | 1998年 / 3331卷

关键词：

electro-deposited resist; X-ray lithography; deep depth-of-field;

D O I：

10.1117/12.309615

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Proximity printing using synchrotron X-ray lithography provides high resolution pattern transfer with large depth of field, low diffraction effects and no reflection from the substrate. Electro-plating of photo-resist allows deposition of thin, uniform films over geometrically complex and topographically diverse, electrically conductive surfaces. Two electrodeposited photoresists produced by Shipley, EAGLE 2100 ED negative tone and PEPR 2400 positive tone resist, have been tested with X-rays demonstrating micron pattern transfer over depths-of-field in fractions of millimeters.

引用

页码：555 / 558

页数：4