Temperature Dependent Thermal Resistance in Power LED Assemblies and a Way to Cope with It

被引：16

作者：

Andras Poppe ^{[1
]}

Gabor Molnar ^{[1
]}

Tamas Temesvoelgyi ^{[1
]}

机构：

[1] entor Graph MicReD Div, H-1117 Budapest XI, Hungary

来源：

26TH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2010 | 2010年

关键词：

LED thermal management; junction temperature of LEDs;

D O I：

10.1109/STHERM.2010.5444276

中图分类号：

O414.1 [热力学];

学科分类号：

摘要：

Different high-end white power LEDs from different LED vendors were studied. The aim of the study was to find the optimal choice of LEDs and thermal management solutions for a street-lighting application. The primary concern was the (real) junction-to-heatsink thermal resistance of the LED or LED assembly and the real junction temperature and the actual light output of the individual LEDs under test. Since in many cases the junction-to-heatsink thermal resistance showed temperature dependence, like-with-like comparison in terms of light output characteristics was done as function of the real junction temperature instead of the reference temperature.

引用

页码：283 / 288

页数：6