On the toughness of ductile adhesive joints

被引:214
作者
Tvergaard, V [1 ]
Hutchinson, JW [1 ]
机构
[1] HARVARD UNIV,DIV APPL SCI,CAMBRIDGE,MA 02138
关键词
D O I
10.1016/0022-5096(96)00011-7
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Crack propagation along one of the interfaces between a thin ductile adhesive layer and the elastic substrates it joins is considered. The layer is taken as being elastic-plastic, and the fracture process of the interface is modeled by a traction-separation law, characterized by the peak separation stress <(sigma)over cap> and the work of separation per unit area Gamma(0). Crack growth resistance curves for mode I loading of the adhesive joint are computed, with emphasis on steady-state toughness, as a function of three extrinsic effects:layer thickness, layer-substrate modulus mismatch, and initial residual stress in the layer. Conditions under which separation first occurs well ahead of the initial crack tip are discussed.
引用
收藏
页码:789 / 800
页数:12
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