Vacuum encapsulation of resonant devices using permeable polysilicon

被引：52

作者：

Lebouitz, KS ^{[1
]}

Mazaheri, A ^{[1
]}

Howe, RT ^{[1
]}

Pisano, AP ^{[1
]}

机构：

[1] Univ Calif Berkeley, Berkeley Sensor & Actuator Ctr, Berkeley, CA 94720 USA

来源：

MEMS '99: TWELFTH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, TECHNICAL DIGEST | 1999年

关键词：

D O I：

10.1109/MEMSYS.1999.746874

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

This paper reports on a novel manufacturable, in situ vacuum micropackaging technology. Permeable polysilicon etch-access windows enable rapid removal of sacrificial material from beneath the shell (e.g., 1 mm wide shells cleared of PSG within 2 minutes) and practically eliminate internal deposition of the sealing film. Inside the vacuum encapsulation shells were lateral microresonators. These devices were selected for packaging because they are well characterized vacuum probes. Measured mechanical quality factors four months after sealing have been shown to be above 3000. These quality factors indicate a cavity pressure near 600 mTorr four months after vacuum encapsulation.

引用

页码：470 / 475

页数：6

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