Electroadhesive microgrippers

被引:53
作者
Monkman, G [1 ]
机构
[1] Fachhsch Regensburg, Fachbereich Elektrotech, Mechatron Res Unit, Regensburg, Germany
关键词
adhesion; handling; assembly;
D O I
10.1108/01439910310479595
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Describes the benefits of using electroadhesion when handling very delicate, polished and/or coated optical and electro-optical microcomponents. Electroadhesion is a technique already familiar to those working in the semiconductor industry and is eminently suitable for the handling of microcomponents in air, gas or vacuum.
引用
收藏
页码:326 / 330
页数:5
相关论文
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MONKMAN GJ, 1999, Patent No. 99214033
[6]  
MOORE AD, 1973, ELECTROSTATICS ITS A
[7]  
ZORIL UZ, 1976, ADHAESION, V5, P142