The future of wires

被引:783
作者
Ho, R [1 ]
Mai, KW [1 ]
Horowitz, MA [1 ]
机构
[1] Stanford Univ, Comp Syst Lab, Stanford, CA 94305 USA
关键词
capacitance; delay estimation; electromagnetic coupling; inductance; interconnections; resistance; technology forecasting; wire;
D O I
10.1109/5.920580
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Concern about the performance of wires in scaled technologies has led to research exploring other communication methods. This paper examines wire and gate delays as technologies migrate from 0.18-mum to 0.035-mum feature sizes to better understand the magnitude of the wiring problem. Wires that shorten in length as technologies scale have delays that either track gate delays or grow slowly relative to gate delays. This result is good news since these "local" wires dominate chip wiring. Despite this scaling of local wire performance, computer-aided design (CAD) tools must still become more sophisticated in dealing with these wires. Under scaling, the total number of wires grows exponentially, so CAD tools will need to handle an ever-growing percentage of all the wires in order to keep designer workloads constant. Global wires present a more serious problem to designers. These are wires that do not scale in length since they communicate signals across the chip. The delay of these wires will remain constant if repeaters are used, meaning that relative to gate delays, their delays scale upwards. These increased delays for global communication will drive architectures toward modular designs with explicit global latency mechanisms.
引用
收藏
页码:490 / 504
页数:15
相关论文
共 52 条
  • [1] Agarwal V, 2000, PROCEEDING OF THE 27TH INTERNATIONAL SYMPOSIUM ON COMPUTER ARCHITECTURE, P248, DOI [10.1145/342001.339691, 10.1109/ISCA.2000.854395]
  • [2] ANG M, 2000, IEEE INT SOL STAT CI, P438
  • [3] [Anonymous], 1998 SPRING SEM SER
  • [4] [Anonymous], SKEW TOLERANT CIRCUI
  • [5] Bakoglu H., 1990, CIRCUITS INTERCONNEC
  • [6] Beattie M. W., 1999, Proceedings 1999 Design Automation Conference (Cat. No. 99CH36361), P915, DOI 10.1109/DAC.1999.782224
  • [7] BENSCHNEIDER B, 2000, ISSCC DIG TECH PAPER, P86
  • [8] Bohr MT, 1995, INTERNATIONAL ELECTRON DEVICES MEETING, 1995 - IEDM TECHNICAL DIGEST, P241, DOI 10.1109/IEDM.1995.499187
  • [9] VLSI architecture: Past, present, and future
    Dally, WJ
    Lacy, S
    [J]. 20TH ANNIVERSARY CONFERENCE ON ADVANCED RESEARCH IN VLSI, PROCEEDINGS, 1999, : 232 - 241
  • [10] The importance of inductance and inductive coupling for on-chip wiring
    Deutsch, A
    Smith, H
    Katopis, GA
    Becker, WD
    Coteus, PW
    Surovic, CW
    Kopcsay, GV
    Rubin, BJ
    Dunne, RP
    Gallo, T
    Knebel, DR
    Krauter, BL
    Terman, LM
    SaiHalasz, GA
    Restle, PJ
    [J]. ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 1997, : 53 - 56