MEMS reliability from a failure mechanisms perspective

被引：240

作者：

van Spengen, WM

机构：

[1] IMEC, B-3001 Heverlee, Belgium

[2] Katholieke Univ Leuven, EE Dept, B-3001 Heverlee, Belgium

来源：

MICROELECTRONICS RELIABILITY | 2003年 / 43卷 / 07期

关键词：

D O I：

10.1016/S0026-2714(03)00119-7

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Over the last few years, considerable effort has gone into the study of the failure mechanisms and reliability of micro-electromechanical systems (MEMS). Although still very incomplete, our knowledge of the reliability issues relevant to MEMS is growing. This paper provides an overview of MEMS failure mechanisms that are commonly encountered. It focuses on the reliability issues of micro-scale devices, but, for some issues, the field of their macroscopic counterparts is also briefly touched. The paper discusses generic structures used in MEMS, stiction, creep, fatigue, brittle fatigue in silicon, wear, dielectric charging, breakdown, contamination and packaging. (C) 2003 Elsevier Ltd. All rights reserved.

引用

页码：1049 / 1060

页数：12

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