Failure mechanisms associated with lens shape of high-power LED modules in aging test

High-power light-emitting diode (LED) modules encapsulated with different lens shapes after a thermal-aging test were studied experimentally and numerically. Samples from different manufacturers were aged at 80 degrees C, 100 degrees C, and 120 degrees C under a constant driving voltage of 3.2 V. The results showed that the LED modules encapsulated with a hemispherical-shaped plastic lens exhibited a better lifetime due to better thermal dissipation than those with cylindrical- or elliptical-shaped plastic lenses. Results also showed that the optical power of the LED modules increased after removing the plastic lens because degradation of the lens material decreased the amount of light. The key module package-related failure modes under thermal-aging were identified as the degradation of the plastic lens and lens material. A finite-element method (FEM) simulation showed that thermal and major principle stress distributions of the high-power LED modules were dependent on aging temperature. Both experimental and FEM simulated results clearly, indicated that a uniformly thermal dissipation to minimize the thermal effect along the thermal path from the LED chip to the plastic lens is essential to extend the operating life of high-power LED modules.