Automatic microassembly of radar sensors for automotive applications

被引：2

作者：

Nienhaus, M ^{[1
]}

Ehrfeld, W ^{[1
]}

Michel, F ^{[1
]}

Graeff, V ^{[1
]}

Wolf, A ^{[1
]}

机构：

[1] Inst Mikrotech Mainz GmbH, D-55129 Mainz, Germany

来源：

MICROMACHINING AND MICROFABRICATION PROCESS TECHNOLOGY IV | 1998年 / 3511卷

关键词：

gripper; microassembly; die ejector; photoetchable glass; mu-EDM;

D O I：

10.1117/12.324291

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

For the assembly of miniaturized radar distance sensors vacuum grippers for handling touch sensitive and very small millimeterwave monolithic integrated circuits ((MIC)-I-3's) have been developed. The grippers are designed modularly to allow different combinations of gripper heads, chip-specific gripper plates and gripper exchange interfaces. The manufacture of the gripper components by mu-EDM and the batch processing of photoetchable glass is presented. In addition, a solution for the removal of M3IC's from adhesive carriers, such as VR Gel-Paks and bluetape with vacuum support has been developed which is suitable for automatic pick & place machine routines.

引用

页码：135 / 142

页数：8