Preliminary investigations of active disassembly using shape memory polymers

被引:20
作者
Chiodo, JD [1 ]
Billett, EH [1 ]
Harrison, DJ [1 ]
机构
[1] Brunel Univ, Egham TW20 OJZ, Surrey, England
来源
FIRST INTERNATIONAL SYMPOSIUM ON ENVIRONMENTALLY CONSCIOUS DEGIGN AND INVERSE MANUFACTURING, PROCEEDINGS | 1999年
关键词
D O I
10.1109/ECODIM.1999.747681
中图分类号
X [环境科学、安全科学];
学科分类号
08 ; 0830 ;
摘要
This paper reports initial results in the application of Shape Memory Polymer (SMP) technology To the Active Disassembly of electronic products. The smart material SMP of Polyurethane (PU) composition was employed. Created for these experiments, were novel SMP releasable fasteners, with which it is possible to effectively disassemble products at specific triggering temperatures at the end of their life (EoL). This disassembly technique is termed Active Disassembly using Smart Materials (ADSM), and has been successfully demonstrated on a variety of products using other smart materials. Whilst developed primarily as a universal disassembly technique, cost effectiveness is apparent. Heat sources of +70, +100 and +225 degrees C were employed to raise the releasable fasteners above their trigger temperatures, in the case of SMP this would be the Glass Transition Temperature (Tg). The development of releasable fasteners and applications in electronic products is described.
引用
收藏
页码:590 / 596
页数:7
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