Putting passives in their place

被引：4

作者：

Ulrich, R

Schaper, L

机构：

来源：

IEEE SPECTRUM | 2003年 / 40卷 / 07期

关键词：

D O I：

10.1109/MSPEC.2003.1209609

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The reduction in the size of passive components to make thinner mobile phones is discussed. Integrated passives have been used for decades in the ceramic substrates that underlie circuits in military, microwave and mainframe computer systems. A growing portion of the circuit board market is using flex which are laminated stacks of unreinforced polyimide polyester, or layers of other polymer films with copper traces on both sides.

引用

页码：26 / 30

页数：5